Electrodeposited copper foil for printed wiring board and method of manufacturing the same

摘要

An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 mu m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 mu m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.