发明名称 METHOD OF SOLDERING PRINTED BOARD, AND JET SOLDER VESSEL
摘要 PROBLEM TO BE SOLVED: To eliminate use of power from outside, prevent jet condition from changing by the adhesion of an oxide and prevent a bridge, an icicle, etc., from being generated. SOLUTION: In this method, primary soldering is performed for a printed board by the roughened jet waves of a primary jet nozzle, and then soldering is performed again with the gentle jet waves of a secondary jet nozzle. In this case, meandering waves are made by letting fused solder flow out of the narrow outlet 9 of a jet 5, and applying the fused solder having flown out to the entry side to the wall face 12 of a trough 10, and making it interfere with the fused solder surging from behind. Performing the soldering of the printed board with the meandering waves will enable the soldering without a bridge or an icicle.
申请公布号 JP2000040872(A) 申请公布日期 2000.02.08
申请号 JP19980223726 申请日期 1998.07.24
申请人 SENJU METAL IND CO LTD 发明人 OGAWA TADAMICHI;WATANABE MASAHIRO;TOU KI
分类号 B23K1/08;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/08
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