发明名称 HIGH FREQUENCY RELAY
摘要 PROBLEM TO BE SOLVED: To provide a high frequency relay having high adhesive strength by a sealing material between a base to be mounted with a shield plate and the inner peripheral surface of a mounting hole to position the base. SOLUTION: A housing is composed of a main base 1 and a case 4. A mounting hole 20 to position a base 10 is formed in the main base 1. In the base 10, a notch part 21 to make a distance between the inner peripheral surface and the outer peripheral surface of the mounting hole 20 larger than other parts is individually formed on each inner peripheral surface along the longitudinal direction of the mounting hole 20. After the case 4 is jointed to the main base 1, a sealing material 50 is filled in a pivotal part from the back side of the main base 1. Since the notch part 21 is formed, the sealing material 50 easily flows into the housing.
申请公布号 JP2000048700(A) 申请公布日期 2000.02.18
申请号 JP19980212125 申请日期 1998.07.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TSUKA KAZUMASA;KADOYA KENJI;NAKAHATA ATSUSHI
分类号 H01H50/10;(IPC1-7):H01H50/10 主分类号 H01H50/10
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