| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for inspection of a cream solder piece on a printed circuit board. SOLUTION: The apparatus and method are featured in such a way that a camera 43 which picks up the image of a cream solder piece 41 coated on the surface of a printed circuit board 42 is provided. In addition, a first illumination part 44 which illuminates the cream solder piece 41 in such a way that light which is reflected from the edge face of the cream solder piece 41 forming an inclination to the surface of the printed circuit board 42 is directed to the camera 43 is provided. In addition, a second illumination part 45 which illuminates the cream solder piece 41 in such a way that light which is reflected from the surface of the cream solder piece 41 parallel to the surface of the printed-circuit board 42 is directed to the camera 43 is provided. In addition, a control part 46 which controls the camera 43, the first illumination part 44 and the second illumination part 45 and by which an image photographed by the camera 43 is binarized and image-processed is provided.
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