| 摘要 |
PROBLEM TO BE SOLVED: To shorten inspection time for 'timing inspection' which requires longer inspection time than 'function inspection', in a delivery inspection for a semiconductor device. SOLUTION: At 'timing inspection' of output signals B and C, which are outputted from a semiconductor device 200 to an input signal A inputted from an inspection circuit 1033A to the semiconductor device 200, the output signal C is detected after a specified delay period through a reference output device 112B in an inspection circuit 1033B, and a reference input device 113C of an inspection circuit 1033C after searching a change point of the output signal B, for determining whether the output signal C changes within a specified delay period.
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