发明名称 PRETREATMENT FOR ELECTROPLATING
摘要 PROBLEM TO BE SOLVED: To plate a specified region easily, effectively and firmly by irradiating a polymer formed article obtained by adding a galss filler and an inorg. filler such as a ceramic grain to a polymer material with a laser beam of specified wavelength, fluence and input energy. SOLUTION: An inorg. filler is added to a polymer material such as liq.- crystal polymer, polyether sulfone, polybutylene terephthalate, polycarbonate, polyimide and epoxy resin, and the obtained polymer parts are irradiated with a laser beam. The laser beam has <=600 nm wavelength and 0.1-0.51 J/cm2/pulse fluence, the total input energy is 10-500 J/cm2, and the fluence and the number of irradiations are preferably so controlled that the irradiated region has an electrical conductivity suitable for electroplating. Besides, a glass filler, a ceramic grain or the like are used as the inorg. filler, and the addition is preferably controlled to 10-50 wt.%. Consequently, the scattering region of the debris of laser beam irradiation is limited, and the region to be plated is made electrically conductive.
申请公布号 JP2000212793(A) 申请公布日期 2000.08.02
申请号 JP19990011716 申请日期 1999.01.20
申请人 AGENCY OF IND SCIENCE & TECHNOL;OMRON CORP 发明人 HIRONO SATOSHI;TANAKA HIROKAZU;NIINO HIROYUKI;YABE AKIRA
分类号 C25D5/56;(IPC1-7):C25D5/56 主分类号 C25D5/56
代理机构 代理人
主权项
地址