| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition capable of forming a high-performance cured film excellent in heat resistance, adhesion, mechanical properties, and electrical properties by including an acid-modified vinyl-containing epoxy resin (A) with an epoxy curing agent and a photoinitiator. SOLUTION: This composition comprises 20-80 wt.% acid-modified vinyl- containing epoxy resin, 1-50 wt.% epoxy curing agent represented by formula I, 0.5-20 wt.% photoinitiator (e.g. benzoin methyl ether), 0.1-20 wt.% triazine compound (e.g. melamine), and 0.1-20 wt.% epoxy-containing alkoxysilane compound. Component A is obtained by reacting a saturated or unsaturated polybasic acid anhydride with the reaction product of an epoxy compound selected from among novolak, bisphenol A, and salicylaldehyde epoxy resins represented by formulae II to IV, etc., with an unsaturated monocarboxylic acid. In the formulae, R1 to R9 are each hydrogen, a 1-4C alkyl, or the like; R5 to R7 are each hydrogen or methyl; X is -S-, -O-, or the like; Y is glycidyl; Z is hydrogen; and n is 1 or greater.
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