发明名称 |
Auto slurry deliver fine-tune system for chemical-mechanical-polishing process and method of using the system |
摘要 |
An auto slurry deliver fine-tune system and a method using the system is discloses. A slurry flow system varies the flow rate of the slurry in a CMP system and the distance between the slurry injector and the polish head of the CMP system. A current detect system detects the current driving the turn-table of the CMP system. Moreover, a judgement system determines whether the current is minimum in order to determine that the flow rate and the distance are optima.
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申请公布号 |
US6410441(B1) |
申请公布日期 |
2002.06.25 |
申请号 |
US19990458827 |
申请日期 |
1999.12.13 |
申请人 |
WORLDWIDE SEMICONDUCTOR MANUFACTURING CORP. |
发明人 |
NIU PAO-KANG |
分类号 |
B24B37/04;B24B57/02;(IPC1-7):H01L21/302 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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