发明名称 Auto slurry deliver fine-tune system for chemical-mechanical-polishing process and method of using the system
摘要 An auto slurry deliver fine-tune system and a method using the system is discloses. A slurry flow system varies the flow rate of the slurry in a CMP system and the distance between the slurry injector and the polish head of the CMP system. A current detect system detects the current driving the turn-table of the CMP system. Moreover, a judgement system determines whether the current is minimum in order to determine that the flow rate and the distance are optima.
申请公布号 US6410441(B1) 申请公布日期 2002.06.25
申请号 US19990458827 申请日期 1999.12.13
申请人 WORLDWIDE SEMICONDUCTOR MANUFACTURING CORP. 发明人 NIU PAO-KANG
分类号 B24B37/04;B24B57/02;(IPC1-7):H01L21/302 主分类号 B24B37/04
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