| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for evaluating silicon wafer surface-quality, by which variance of evaluation of silicon wafer surface-quality in an SCL-R evaluation method can be eliminated and stable evaluation can be performed. SOLUTION: In the method for evaluating a silicon wafer, the silicon wafer surface is etched for a long time by using a treatment solution consists of ammonia water, hydrogen peroxide water, and water, the number of LPD formed on the surface of silicon wafer is checked, thereby, the silicon wafer is evaluated. A chelating agent is added in the treatment solution.
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