| 摘要 |
PROBLEM TO BE SOLVED: To mount a semiconductor chip on a lead frame at a fast speed in a state in which a floor occupying area is reduced after picking up the chip in a semiconductor wafer or the like. SOLUTION: A method for mounting the semiconductor chip comprises the steps of reciprocating a first collet head 8 of two collet heads in each semiconductor chip 3 between a pick-up position at the semiconductor wafer 1 and a mounting position in the lead frame 7, and a second collect head 10 between the mounting position and the pick-up position in the reverse direction to each other, and passing both the heads 8 and 10 each other on the way of reciprocating in reverse directions.
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