| 摘要 |
The present invention provides an apparatus and a method for surface treatment to substrates whereby the quality of substrates can be maintained by preventing an excessive plasma treatment to substrates. In carrying out the plasma treatment to a surface of the substrate in a reaction chamber, there are provided an emission spectroscopic analysis device or a mass analyzer, and a controller, so that an energy of ions in plasma is controlled to decrease when, e.g., bromine included in the substrate is detected, and the surface treatment to the substrate is controlled to stop when removing impurities of the substrate is detected to end. The bromine once separated from the substrate is prevented from adhering again to the substrate to corrode the substrate. Moreover, ions are prevented from being excessively irradiated to the substrate when the removal of impurities ends, thereby reducing damages to the substrate. The substrate quality is maintained accordingly.
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