发明名称 ORGANIC BINDER FOR METAL-POWDER INJECTION MOLDING
摘要 PROBLEM TO BE SOLVED: To solve such a problem that conventional organic binders for metal injection molding need a long treatment time in a thermal degreasing step, and hardly show a high degreasing rate in a solvent-extraction degreasing method, and that there is no organic binder effective for both. SOLUTION: The organic binder has three or more different levels of thermal decomposition temperatures, and comprises several organic polymers each having a different solvent extractability, a wax lubricant, and a dispersant. Then, the binder can be satisfactorily degreased in a short time with the thermal degreasing method, because the polymers are sequentially decomposed in three or more stages with the rise of the temperature, and as a result, hardly cause a failure such as deformation or swell of the compact. The binder is degreased in the high degreasing rate with the solvent extraction method as well, because the other organic polymers than certain sorts of organic polymers insoluble in the solvent, the wax lubricant and the dispersant are extracted and removed. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003286503(A) 申请公布日期 2003.10.10
申请号 JP20020132095 申请日期 2002.03.28
申请人 SHIZUOKA PREFECTURE 发明人 ITO YOSHINORI;HARIYUKI TATSUYA;SATO KENJI;ISOBE KENJI;OTAKE MASATOSHI;MIURA HIDEO
分类号 B22F3/02;(IPC1-7):B22F3/02 主分类号 B22F3/02
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