| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate and a method for manufacturing the same, in which the wire density is increased, and the signal transfer path is reduced without reducing the wire diameter or the pitches of the conductive traces. SOLUTION: The circuit board 400 comprises a base material, a hole 440, metal layers 450a and 450b, and an insulator 480. The base material is composed of a core material 401 and a plurality of insulating layers 410 and a plurality of conductive trace layers 430 alternately laminated. The metal layers 450a and 450b are formed on the sidewall of the hole 440 and surround the inner wall surface of the hole 440. Lands 460a and 460b surround the circumferential edge of the hole 440. The insulator 480 is filled in the hole 440, and at the same time, divides the hole 440 into two parts. The metal layers 450a and 450b and the lands 460a and 460b are electrically insulated from each other with the insulator 480, and the metal layers 450a and 450b are electrically connected to the conductive trace, in the conductive trace layer 430 via the lands 460a and 460b, respectively. COPYRIGHT: (C)2004,JPO |
