| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an epoxy resin composition for sealing a semiconductor capable of efficiently discharging a volatile gas even under a continuous operation condition. SOLUTION: In the method for manufacturing the epoxy resin composition for sealing the semiconductor using a kneader, the kneader is constituted so that a suction hole is provided to a kneading part on the downstream side in the feed direction of the epoxy resin composition from the kneading region of the kneading part, and a supply port and a discharge port are respectively provided on the upstream side and downstream side in the feed direction of the epoxy resin composition. Simultaneously with the discharge of the gas in the kneader to the outside through the suction hole, the epoxy resin composition is kneaded while sucking the open air through the supply port and the discharge port. COPYRIGHT: (C)2004,JPO&NCIPI |
