| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for picking up a thin semiconductor chip in which recognition miss can be prevented. SOLUTION: In the device for picking up a semiconductor chip 6 held on a sheet 5 and pasted thereto using a pickup head, suction members 24 composed of a porous material are fitted to elevate/lower freely in a plurality of suction grooves 22b provided in a sucking/stripping tool 22a for stripping the sheet 5 from the chip 6 by applying the suction face 22a to the lower surface of the sheet 5 and vacuum sucking the sheet 5 and then an internal hole 21a is vacuum sucked under a state where the suction member 24 is elevated thus sucking the sheet 5 by means of the suction member 24. Since warp of the thin chip 6 can be corrected, stabilized recognition can be ensured and positioning accuracy of pickup can be ensured. COPYRIGHT: (C)2005,JPO&NCIPI |
