发明名称 VAPOR DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition system by which a uniform film is vapor-deposited on the surface of the substrate to be treated by matching the relative positional relation between a substrate holding member and the bottom part of a flow passage composing member with high precision. SOLUTION: In the system, a position measurement apparatus including a laser displacement gauge 24 measuring the distance with the substrate 11 to be treated is arranged in the direction vertical to the main face of the substrate 11 to be treated, the measurement objective parts by the position measurement apparatus in the wall face at which an opening part 10 is formed in the flow passage composing member 7 and in the surface of a substrate holding member 12 are constituted so that laser light emitted from the position measurement apparatus can be reflected at least to a degree required for the measurement, and a position regulation apparatus 18 regulating the positional relation between the flow passage composing member 7 and the substrate holding member 12 and a control apparatus 23 controlling the position regulation apparatus are provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005068502(A) 申请公布日期 2005.03.17
申请号 JP20030300983 申请日期 2003.08.26
申请人 SHARP CORP 发明人 OKADA TOSHINORI;TANAKA NOBUMASA;ARAKI YUTAKA
分类号 C23C16/52;H01L21/205;H01L21/68;(IPC1-7):C23C16/52 主分类号 C23C16/52
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