| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To propose a semiconductor device making effective use of a tape carrier in a good yield while a flexible substrate is reduced. <P>SOLUTION: A liquid crystal driver chip 15 is mounted in a flexible substrate 11. In the board 11, an output-side outer lead 22 and an input-side outer lead 23 are formed in such a way that they are divided into two facing sides, and an inner lead 24 is formed for connection with the chip 15. An output terminal 28 is allocated in two sides which make a right angle to one side nearest to an output-side outer lead 22 among the edges of four sides in the chip 15. Wiring 12a is led out from the inner lead 24 connected with the output terminal 28 to the output-side outer lead 22. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
