| 摘要 |
This film-forming method for forming a thin film on a substrate has an adhering step, an external force removing step, and a film-forming step. In the adhering step (step B), an adhering member 31 is placed such that the adhering member is in contact with one surface of a substrate 30, and in a state wherein an external force is applied in the direction in which the substrate 30 and the adhering member 31 overlap each other, the substrate 30 and the adhering member 31 are placed under vacuum. In the external force removing step (step C), an external force is removed under atmospheric pressure or vacuum. In the film-forming step (step E), the thin film is formed on one surface or the other surface of the substrate 30. |
