发明名称 RESIN MOLDING METHOD
摘要 PURPOSE:To mold a clear thick product with no deformation, by a method wherein, after surrounding of a sprue, a runner, and a gate of a mold are heated to fusing temperature of resin and injection-molding takes place, they are cooled. CONSTITUTION:An injection takes place under a condition that resin is brought to an equivalent flow to that of resin at a nozzle by heating at least one of a sprue, a runner and a gate of a mold at an injecting time, and physical properties of a material are improved and a molded product is reduced in deformation by decreasing of resin temperature and an injecting pressure. Meanwhile, after the injection is completed, at least one of the sprue, the runner and the gate, which are heated at an injecting time, is cooled to cure the resin around the cooled part, and enables it to be also used with thermoplastic resin like a cold runner mold. Additionally, a rapid heating is performed by high temperature steam, a heater, high temperature oil, thermoelectric element, high frequency heating or the like and meanwhile, it is advantageous that a cooling is conducted through circulation of cooling water.
申请公布号 JPS5812740(A) 申请公布日期 1983.01.24
申请号 JP19810111780 申请日期 1981.07.16
申请人 MATSUSHITA DENKI SANGYO KK 发明人 MATSUDA SHIYUNSUKE;ITOU AKITAKE;MITANI KATSUAKI;INOUE TOSHIAKI
分类号 B29C35/00;B29C45/00;B29C45/72 主分类号 B29C35/00
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