| 摘要 |
PURPOSE:To enable to perform securely and uniformly contact of an electrode and a semiconductor slice, to necessitate neither vacuum pump nor jet head and to eliminate erosion due to treating solution by a method wherein the semiconductor slice is held by an inner head and an outer head, both of which have been screw-connected together. CONSTITUTION:An electrode seat 17, an electrode 18 and a semiconductor slice 19 are inserted in order in the recessed part 15 of an inner head 14, while O-rings 20 are set on the press-welding surfaces 12 of an outer head 11, and the male threads 16 of the inner head 14 are screw-connected with the female threads 13 of the outer head 11. The outer edges of the semiconductor slice 19 are pressingly adhered to the press-welding surfaces 12 of the outer head 11 through the O-rings 20 by the securing force of the inner head 14, and at the same time, are made to contact with the electrode 18, and the semiconductor slice 19 is held between both the heads 11 and 14. The whole holding mechanism is dipped in a treating tank 21 and a treating of the semiconductor slice is performed. As a result, a vacuum pump, which is eroded due to treating solution, is enabled to unnecessitate and even though a phenomenon that the treating solution intrudes in the back surface of the semiconductor slice generates, there is no possibility that the titled device is stopped its operation due to the erosion trouble. |
