Process for the determination and the adjustment of the brightener concentration in copperplating baths, as well as device for implementing this process, in particular for application to the printed circuit industry

摘要

The subject of the present invention is a process for determining and adjusting the concentration of a brightener or of a smoothing agent in a copperplating bath. It is characterised in that the current is measured and the curve of its evolution is plotted by means of a microamperemeter, the peak value I1 of the current is determined and the potential P1 corresponding to this peak is recorded when the potential varies from the zero value to its extreme negative value imposed during a copper deposit phase, during the return of the potential from its extreme negative value to the zero value, and the value I2 of the current corresponding to the potential P1 is determined. <IMAGE>