| 摘要 |
PURPOSE:The title resin composition excellent in moisture resistance, discolora tion resistance, electrical properties, etc., obtained by mixing an epoxy resin having a plurality of epoxy groups in the molecule with a curing agent compris ing a specified aromatic diamine and, optionally, a cure accelerator. CONSTITUTION:The purpose epoxy resin composition for printed-circuit boards is obtained by mixing 1 equivalent of an epoxy resin (A) having at least two epoxy groups (e.g., bisphenol A epoxy resin) with 0.1-1.2 equivalent of an aromatic diamine (B), as a curing agent, of the formula (wherein R is H, a halogen or an alkyl, and n and m are each 1-3) and, optionally, a cure accelerator (e.g., benzyldimethylamine). Examples of components B include 2,2-bis(4- aminophenyl)propane and 2,2-bis(4-amino-3-methylphenyl)propane.
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