Semiconductor chip arrangement

摘要

Semiconductor chip arrangement on a heat sink made of aluminium with an interposed electrical insulation made of ceramic. It is provided that the ceramic (2) is formed on the basis of aluminium, especially on the basis of aluminium oxide, Al2O3, or aluminium nitride, AlN and that between the ceramic (2) and the semiconductor chip (5) a copper layer (4) is arranged. <IMAGE>