发明名称 Manufacturing method for integrated circuit chip carriers and work holder for use in the method
摘要 A workholder for holding a plurality of substrates, the workholder configured in a flat plate having a top surface and a bottom surface which is parallel to the top surface. The top surface spaced a distance from the bottom surface, such that the distance between the top surface and the bottom surface does not exceed a distance between an upper surface and a lower surface of an individual substrate. A plurality of substrate receiving openings extend through the plate, each opening being dimensioned to receive a respective substrate therein. A biasing spring means adjacent to each opening for biasing a substrate in the opening. The biasing spring means being between the top and bottom surfaces of the workholder and not extending beyond the top and bottom surfaces thereof. The configuration of the workholder allows the substrates to be held in the openings of the workholder, while having their upper and lower surfaces projecting beyond the top and bottom surfaces of the workholder respectively. This permits manufacturing steps of metallizing the substrates, imaging, plating, resist removal, etching, assembly, wire bonding and so on, to be carried out on all of the substrates in the workholder simultaneously, as well as permitting the processes to be carried out on both sides of the substrates simultaneously, thereby greatly reducing the cost of manufacturing the substrates.
申请公布号 US4703920(A) 申请公布日期 1987.11.03
申请号 US19860899710 申请日期 1986.08.25
申请人 AMP INCORPORATED 发明人 GRABBE, DIMITRY G.;KORSUNSKY, IOSIFF
分类号 H01L23/00;H01L21/00;H01L21/673;(IPC1-7):B25B1/20 主分类号 H01L23/00
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