发明名称 レーザー加工装置
摘要 PROBLEM TO BE SOLVED: To provide a laser machining apparatus capable of efficiently forming a laser machined hole that reaches a second member from a first member in a workpiece in which the first member formed by a first material and the second member formed by a second material are connected.SOLUTION: A plasma detecting means 9 includes a bandpass filter 93 which allows only the wavelength of the plasma emitted from the first member to pass and a photo detector 94 which receives light having passed through the bandpass filter and outputs a light intensity signal to a control means, and the control means calculates an average value by adding a predetermined number of light intensity signals output from the photo detector 94 each time pulse laser beams are irradiated when a laser beam irradiation means activates and performs laser machining to reach the second member from the first member of the workpiece by irradiating the workpiece with the pulse laser beams, and controls the laser beam irradiation means so that irradiation of the pulse laser beams is stopped when the average value drops to a predetermined value.
申请公布号 JP6017809(B2) 申请公布日期 2016.11.02
申请号 JP20120062365 申请日期 2012.03.19
申请人 株式会社ディスコ 发明人 森數 洋司
分类号 B23K26/00;B23K26/382;B23K26/40 主分类号 B23K26/00
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