发明名称 COPPER-CLAD LAMINATED FOR PRINTED WIRING BOARD WITH IMPROVED HEAT DISSIPATION
摘要 PURPOSE:To obtain a low-cost, strong, corrosion resistant material with improved heat conductivity by using an iron and steel ally and iron and steel chrome alloy as a metal plate of base. CONSTITUTION:A copper-clad laminate for printed-circuit board consists of three layers, namely surface copper foil, center resin insulation layer, and base. The base includes a thin Fe-Cu alloy containing 20-90wt.% Cu and the remainder essentially of Fe, and a thin Fe-Cu-Cr alloy containing 20-90wt.% Cu, 2.5-12wt.% Cr and the remainder essentially of Fe. Such a base is directly prepared in the form of a thin plate by a rapid-cooling coagulation method such as the double roll method without the hot rolling process, thus improving yield. Then, copper foil within material used in combination with this base may be obtained by either the electrolytic method or the rolling method. Resin may be any of heat-resistant thermoplastic resin such as epoxy resin which is normally used.
申请公布号 JPH01128486(A) 申请公布日期 1989.05.22
申请号 JP19870285189 申请日期 1987.11.13
申请人 NIPPON STEEL CORP 发明人 WATANABE KUNIO;NISHIMURA SATORU
分类号 C22C9/00;C22C38/00;H05K1/05 主分类号 C22C9/00
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