| 摘要 |
PURPOSE:To execute a good wire bonding operation without lowering the degree of freedom of the movement of a capillary by a method wherein one part or the whole of a support body is formed by using a magnetic material, a magnet used to attract the support body to a mounting stand is installed in advance and the support body is attracted by using the magnet when a thin lead wire is to be connected to an electrode by making use of an ultrasonic vibration. CONSTITUTION:When a wire bonding operation is executed, the rear surface side of a lead frame 2 is arranged in such a way that the rear surface side is put into a mounting stand 13; a magnet 16 is actuated; the lead frame 2 is attracted by the magnet 16. A wide part of an external lead 6 connected to a support sheet 5 is pressed by using a fixing jig 14. Then, an ultrasonic vibration is applied to a capillary 12; one end of a thin lead wire 4 is connected to an electrode on a power transistor chip 3; the other end is connected to the external lead 6. During this process, because the lead frame 2 is attracted by the magnet 16, it is suppressed that the lead frame slides on the mounting stand 13; the close adhesion performance of a region corresponding to a wire bonding part of the lead frame 2 with reference to the mounting stand 13 is improved; a good bonding operation of the thin lead wire 4 can be executed. |
