发明名称 APPARATUS FOR COIL PRESSURE-BONDING
摘要 PURPOSE:To obtain an apparatus for coil pressure-bonding use whose cooling performance for a coil is good without making the apparatus large-sized by a method wherein a heat conduction sheet whose thermal conductivity is good is installed on the whole surface of an inner circumference face of a reinforcement collar and heat conduction rods whose thermal conductivity is good and which execute a heat exchange between a coolant and the heat conduction sheet are inserted into a plurality of cooling holes which pierce the reinforcement collar. CONSTITUTION:A heat conduction sheet 20 for cooling use is formed to be a semicylindrical shape of a concentric circle with respect to an outer circumference face coming into contact with an inner circumference face of reinforcement collars 15a and 15b and with respect to the reinforcement collars 15a and 15b; it is composed of a material whose thermal conductivity is good, e.g. copper or aluminum. The collars 15a, 15b are fixed to heat conduction sheets 20a, 20b. Heat conduction rods 23 whose tip has been threaded are screwed into holes 24 for heat-conduction rod use until they come into close contact with the heat conduction sheet 20. The heat conduction rods 23 are composed of a material whose thermal conductivity is good; their tip is shaped to be flat; consequently, a heat exchange between a coolant filled at the outer circumference face side of the reinforcement collars 15a, 15b and the heat conduction sheet 20 for cooling use is carried out effectively; a cooling operation and a beat-removing operation of a coil 2 are executed effectively.
申请公布号 JPH02310904(A) 申请公布日期 1990.12.26
申请号 JP19890131833 申请日期 1989.05.25
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SUZAWA CHIZURU
分类号 H05H7/04;H01F6/00;H01L39/04 主分类号 H05H7/04
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