| 摘要 |
A semiconductor device comprises a package body of a ceramic material formed with a stage region for supporting a semiconductor chip and an interconnection region used for external interconnection of the semiconductor device, a semiconductor chip mounted on the stage region of the package body by a layer of a resin that fixes the semiconductor chip on the stage region, an interconnection lead provided on the interconnection region of the package body for external connection of the semiconductor device, an interconnection wire connecting a bonding bad region of the semiconductor chip and the interconnection lead electrically, and a zone of modified surface texture formed on a surface of the package body at a part located between the semiconductor chip and the interconnection region, wherein the zone has a texture with increased density as compared to the rest of the package body.
|
