TRAY FOR LOADING SEMICONDUCTOR PACKAGE

摘要

The tray protects a thermal deformation by support of tray structure, and improves a productivity. The tray includes an inserting recess (11a) which holds a semiconductor package (12), a buffering recess (11c) which is inserted in outer rim (11b) of tray. The temperature of semiconductor inside is 50-145 deg.C during 4-24 hours. The thickness of the tray is 0.2-0.7 mm by a press molding or injection molding.