发明名称 ENCAPSULATION OF SEGMENTED DIAMOND COMPACT
摘要 A diamond compact which comprises at least two interlocking segments of thermally stable, polycrystalline diamond encapsulated with a diamond film is provided wherein the diamond segments are bound to form a composite mass which is overcoated with a diamond film. The diamond film provides added shear strength and an enhanced bending moment to the compact. The segments can also be comprised of diamond particles of a different average grain size to provide improvements in impact resistance and abrasion resistance in tools used for drilling and mining. These compacts can be prepared by cutting diamond clusters to provide complementary surfaces, bonding these surfaces together to form one composite mass and overcoating the mass with a diamond layer by chemical vapor deposition.
申请公布号 CA2108405(A1) 申请公布日期 1995.04.15
申请号 CA19932108405 申请日期 1993.10.14
申请人 GENERAL ELECTRIC COMPANY 发明人 FRAZEE, RONALD L.
分类号 B24D3/06;E21B10/56;E21B10/573;E21B10/58;(IPC1-7):B24D3/10;B23P15/28;C23C16/22 主分类号 B24D3/06
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