IMAGE PICKUP MODULE AND THE MANUFACTURING METHOD THEREOF

摘要

An image pickup module includes a fame, two or more than two image pickup devices including electric circuit board and plural affixing gel layers. The frame includes two or more than two image pickup openings, and each of the image pickup devices is disposed in one of the image pickup openings. Each of the image pickup devices is adhered to an inner edge of one of the image pickup openings through one of the affixing gel layers, so as to affix the image pickup devices to the frame. A manufacture method of an image pickup module is also provided.

主权项

1. An image pickup module comprising:
a frame comprising a plurality of image pickup opening and at least a bottom opening locating below the image pickup openings; a plurality of image pickup device, each disposed in the frame and capturing images through each of the image pickup openings respectively, and each comprising a side surface and a circuit board which extends outwardly through the bottom opening; a plurality of gel filling space, formed between an inner edge of each of the image pickup openings and the side surface of one of the image pickup devices; and a plurality of affixing gel layer, each disposed in one of the gel filling spaces, wherein each of the image pickup devices is adhered to one of the affixing gel layer, and each of the image pickup openings of the frame surrounds the side surface of each of the image pickup devices.