| 摘要 |
At least one micro-hole (6) is arranged in the casing (3) of the encapsulated component. The size of the micro-hole allows gas to flow through but prevents ingress of fluid. The micro-hole or holes is/are made in an arbitrary shape with a diameter of between 10 and 50 micrometres, e.g. 30 micro-metres. The component is for fitting on a circuit board incorporating an electronic circuit and provided with a casing. At least one micro-hole is provided in casing encapsulating the component (1) to allow air passage for pressure compensation between the casing inside and outside but prevents washing fluid having access to the circuit (2). |
