发明名称 Method of fabricating semiconductor device
摘要 Method of forming a crystalline silicon film having excellent characteristics. An amorphous silicon film is formed on a substrate having an insulating surface. The amorphous film is thermally annealed at 400 DEG -620 DEG C., preferably at 520 DEG -620 DEG C., more preferably at 550 DEG -600 DEG C., for 1-12 hours. The silicon film is crystallized to a crystallinity of 0.1-99.9%, preferably 1-99%. Then, the silicon film is irradiated with UV laser radiation. Thus, the crystallinity of the silicon film is improved in a short time. Crystalline silicon films having uniform characteristics are obtained.
申请公布号 US5681759(A) 申请公布日期 1997.10.28
申请号 US19950388845 申请日期 1995.02.15
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 ZHANG, HONGYONG
分类号 H01L21/02;H01L21/20;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/78;H01L29/786;(IPC1-7):H01L21/265 主分类号 H01L21/02
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