| 摘要 |
PROBLEM TO BE SOLVED: To obtain a bump electrode forming method for forming bump electrodes having a fine pitch, while securing a desired height for the bump electrodes, with high throughput and at low cost. SOLUTION: A sheet of bump material 6 is positioned facing opposite to a circuit board 1 having an electrode land 2 formed thereon, position on the bump material sheet 6 opposed to the land 2 from a side of the material opposed to the board 1 toward the land 2 is irradiated with a laser beam 5, the material 6 irradiated with the beam 5 is compressed by a gas 7 which is flowing towards the land 2 in the same direction is the beam 5.
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