| 摘要 |
PROBLEM TO BE SOLVED: To securely crimp by preventing foreign matter from adhering to the internal surface of a cavity when laminating resin boards for integration. SOLUTION: In a method of manufacturing a semiconductor package, when laminating a plurality of resin circuit boards 10a, 10b, and 10c provided with openings for containing semiconductor elements with an adhesive from the bottom side of a cavity to the opening side in decreasing order of opening size, the portions where the bonding pads of wiring patterns 16a and 16b of the openings 14a and 14b are exposed are covered, and therewith protective tapes 20a and 20b bridging the openings provided at the upper resin circuit boards to be laminated are bonded. The resin circuit boards 10a and 10b are aligned with the upper resin circuit boards 10b and 10c so as to bridge the openings 14b and 14c with the protective tapes 20a and 20b to form a laminate, and the protective tapes are then removed.
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