发明名称 RESIN-SEALING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a resin-sealing device which realizes the device layout which can easily increase extension units, having a variety of function and facilitates the change of device form in accordance with changes in the kinds of moldings. SOLUTION: A supplying part A for supplying the molding 1 to be molded, an accommodating part B for accommodating the molding 2 and a supplying and accommodating area P, having a degating part C separating the molding 2 from unwanted resin, are arranged collectively in one direction side to a molding area Q having a resin sealing part D, adjoining each other. Extension units having a variety of functions can be installed in an extension area R formed in the periphery of the molding area Q.
申请公布号 JP2000164612(A) 申请公布日期 2000.06.16
申请号 JP19980339715 申请日期 1998.11.30
申请人 APIC YAMADA CORP 发明人 OTSUBO YASUSHI;YANAGISAWA MAKOTO;MIYAMOTO TAKUYA;NISHIZAWA YOSHITERU
分类号 H01L21/56;(IPC1-7):H01L21/56 主分类号 H01L21/56
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