SEMICONDUCTOR DEVICE AND ITS MANUFACTURE, AND OUTER LEAD FORMING DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce poor electrical connections between an outer lead section and an electrode terminal on a component mounting substrate by making the height from a mounting face of the outer lead section to an inner lead section of leads disposed in the central part of an arrangement of a plurality of leads which are larger than the height of those disposed on both ends of the arrange ment to make the mounting face of the outer lead section horizontal. SOLUTION: Outer lead sections 4B of leads for a semiconductor device are held between the surface of an upper molding die 11 and the surface of a lower molding die 12. Under this condition, leads are formed and cut, using a forming punch 13 and a lead-cutting die (stand) 14. The leads are formed and cut so that the height from a mounting face of the outer lead section 4B to an inner lead section of the leads disposed in a central part of an arrangement of a plurality of leads is larger than the height of those disposed on both ends of the arrangement for making the mounting face of the outer lead section 4B horizontal (flat). Thereby, a poor electrical connections between the outer lead sections and electrode terminals on a component mounting substrate can be reduced, and mounting yield can be increased.