发明名称 METHOD AND DEVICE FOR COMPRESSION BONDING
摘要 PROBLEM TO BE SOLVED: To provide a method and device for compression bonding for improved electrode-matching accuracy and eliminated compression bonding dislocation between a TAB and a heat seal, related to the electrode-matching between the TAB and the heat seal. SOLUTION: When a TAB 3 and a heat seal 2 are thermo compression- bonded on a jig holder, a deflection correcting region 5 around a compression bonding part 7 is provided with a presser jig 6 provided with a protruding part, and the presser jig 6 is pulled outside the TAB 3 with the protrusion inserted in the hole provided at the TAB 3 and the heat seal 2, for correcting the warpage of the TAB 3 and the heat seal 2.
申请公布号 JP2000164642(A) 申请公布日期 2000.06.16
申请号 JP19980336778 申请日期 1998.11.27
申请人 NEC SHIZUOKA LTD 发明人 ISHIKAWA MASAHIRO
分类号 H01R11/01;H01L21/60;H01R43/00;(IPC1-7):H01L21/60 主分类号 H01R11/01
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