| 摘要 |
PURPOSE:To improve an accuracy of the mounting position of electronic parts, by recognizing the position of the electronic parts sucked by a sucking nozzle and the position of the wiring pattern of a glass board, which are in mounting states respectively, in the mounting position through one position-recognizing camera simultaneously. CONSTITUTION:A resin to be cured by ultraviolet rays is applied to a carried-in glass board A. Then, an electronic parts B is sucked from an electronic-parts feeding means 4 by a sucking nozzle 3, and the kind of the electronic parts B sucked by the sucking nozzle 3 is recognized by a parts recognizing camera 5. Then, the sucking nozzle 3 and a position recognizing camera 20 are moved to a mounting position, and the position of the electronic parts B sucked by the sucking nozzle 3 and the position of the wiring pattern of the glass board A are recognized by the position recognizing camera 20 through the glass board A. Based on the positional recognition results thereof, the relative position of the sucking nozzle 3 to the glass board A is corrected, and the electronic parts B is mounted on the mounting position of the glass board A. Then, the electrodes of the electronic parts B and the glass board A are bonded to each other. |
