| 摘要 |
PROBLEM TO BE SOLVED: To provide a satisfactory method for plating a metallic film by which a metal oxide formed on the surface of an adhesion film used in an electroplating method is removed without removing the adhesion film, and the defect of burying caused by the generation of voids is not generated at the time of forming a metallic film by an electroplating method and to form metallic wiring high in reliability. SOLUTION: In an electroplating method provided with a stage in which a metallic film 17 is formed on a substrate metal (adhesion film 15) by an electroplating method, a pretreating stage in which only a metal oxide 16 formed on the surface of the substrate metal is removed before executing electroplating is provided. As a pretreating chemical for removing only the metal oxide 16, a soln. contg. oxalic acid or citric acid or contg. both oxalic acid and citric acid is used as the chemical solution contg. hydrochloric acid or a carboxylic group.
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