| 摘要 |
A structure that is compatible with passive alignment, and is capable of integration onto a micro-optical bench system, provides for the secure attachment of optical components to the bench. The structure comprises a base and a clip structure for an optical component that is formed in the base. The clip structure can be etched into bulk material of the base. In one implementation, the clip structure is created using reactive ion etching in silicon or silicon-on-insulator (SOI) wafer material. In the preferred embodiment, the clip comprises an alignment wall and a resilient arm. The resilient arm engages a first side of the optical component to urge a second side of the optical component into engagement with the alignment wall. This cooperation between the arm and the alignment wall allows for precise registration of the optical component against the alignment wall to scales attainable with semiconductor lithography. |
