发明名称 |
COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A coil electronic component is provided that includes a magnetic body including a core part and a coil wound around the core part. The core part includes metal flakes and a resin, and is formed by injection-molding. Methods of manufacturing the coil electronic component are provided. The methods include injection-molding metal flakes and a resin to prepare a cylindrical structure around which the coil is provided. |
申请公布号 |
US2016343486(A1) |
申请公布日期 |
2016.11.24 |
申请号 |
US201614995986 |
申请日期 |
2016.01.14 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM You Na;PARK Moon Soo;LEE Dong Hwan;CHA Hye Yeon;LEE Jong Ho |
分类号 |
H01F1/24;H01F41/02;H01F41/04 |
主分类号 |
H01F1/24 |
代理机构 |
|
代理人 |
|
主权项 |
1. A coil electronic component comprising:
a magnetic body including a core part and a coil wound around the core part, wherein the core part includes metal flakes and a resin. |
地址 |
Suwon-si KR |