发明名称 |
Method for forming electrode |
摘要 |
A method for forming an electrode on a surface of an electronic device formed of a ceramic material is disclosed. The method comprises the steps of: adjusting a polarity of a surface charge by immersing the electronic device in a solution containing a cationic or an anionic surfactant; depositing an electroconductive material on the surface of the electronic device by contacting the electronic device with an electroconductive solution containing the electroconductive material having a polarity opposite to the adjusted polarity of the surface charge; and performing electrolytic plating using the electroconductive material deposited on the surface of the electronic device as an underlying metal film.
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申请公布号 |
US6358390(B1) |
申请公布日期 |
2002.03.19 |
申请号 |
US20000670930 |
申请日期 |
2000.09.28 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
YOSHIDA YASUSHI;KUNISHI TATSUO |
分类号 |
H01G4/12;C23C18/16;C25D5/34;C25D5/54;C25D7/00;C25D21/12;H01G4/252;H01G4/30;H05K1/03;H05K3/18;(IPC1-7):C25D5/54 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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