发明名称 Layer forming material and wiring forming method
摘要 A layer forming material is a compound which has a structure of six-membered ring coordinated to Cu and containing Si, and of which general formula is represented by the following chemical formula:wherein X1 and X2 are elements of the VI group of the same or different types which are coordinate-bonded to Cu, and of which examples include O, S, Se, Te and the like, at least one of Y1, Y2 and Y3 is Si, L is a group which has a double or triple bond and which is able to supply electrons to Cu, and each of R1 and R2 is any of SiF3, SiH3, CF3 and CH3 for example.
申请公布号 US6372928(B1) 申请公布日期 2002.04.16
申请号 US19980003826 申请日期 1998.01.07
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KAWAGUCHI AKEMI;TERAI YUKA;YANO KOUSAKU
分类号 C23C16/18;H01L21/3205;H01L21/768;H01L23/532;(IPC1-7):C07F1/08;C23C16/00 主分类号 C23C16/18
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