| 摘要 |
PROBLEM TO BE SOLVED: To provide both an epoxy resin molding material for sealing having excellent reliability such as fluidity, adhesion, solder reflow and moisture resistances and an electronic part device equipped with an element sealed with the epoxy resin molding material for sealing. SOLUTION: This epoxy resin molding material for sealing consists essentially of (A) an epoxy resin, (B) a curing agent, (C) a silane coupling agent having a ketimino group and (D) an inorganic filler. The electronic part device is equipped with the element sealed with the epoxy resin molding material for sealing.
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