| 摘要 |
PURPOSE: An absorbing head for transferring a BGA(Ball Grid Array) semiconductor package is provided to improve productivity of a BGA semiconductor package manufacturing line by reducing a processing time of a BGA package singulation system. CONSTITUTION: A base(10) is fixed to a front end of a picker. An air cylinder(20) is mounted on the base(10). The air cylinder(20) is used as a driving device. A plurality of racks(30) are operated by the air cylinder(20). A plurality of planar cams(40) are connected with the racks(30). A plurality of bars(50) are arrayed in a shape of grating in the inside of the planar cams(40). The bars(50) are separated or collected by the operation of the planar cams(40) since both ends of the bar(50) are connected with the planar cams(40). A plurality of vacuum absorbing blocks(60) are used for absorbing a BGA semiconductor package.
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