| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which generates few warpage of a package and has an excellent reflow resistance and to provide a semiconductor device using the same. SOLUTION: This epoxy resin composition contains (A) a polyfunctional epoxy resin represented by general formula (1) below (wherein, R1-R4 denote a hydrogen atom or a 1-20C alkyl group respectively which may be identical or different; n is an integer of 0, 1 or more), (B) a phenol resin, (C) a curing accelerator and (D) an inorganic filler. A semiconductor device using the same is also provided.
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