| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing which is excellent in moldability, generates no warpage and generates few cracks caused by reflow at a high temperature since a crack tends to take place in a resin as the reflow temperature rises while the reflow temperature needs to be raised as compared with the existing solder when a lead-free solder is used. SOLUTION: This epoxy resin composition for sealing contains as an essential component (A) an epoxy resin, (B) a phenol resin having a spiro ring, (C) a curing accelerator, (D) a coupling agent and (E) silica powder. The content of the silica powder (E) amounts to 70-95 wt.%.
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