发明名称 PROCESS AND LIQUID FOR TREATING SILVER-PLATED LAYER
摘要 PROBLEM TO BE SOLVED: To provide a process and a liquid for treating a silver-plated layer for improving its strength and corrosion resistance. SOLUTION: (1) In the process for treating the silver-plated layer, the silver-plated layer is treated with an organic compound having a reactivity or compatibility with silver. (2) The treatment liquid for the silver-plated layer contains the organic compound having a reactivity or compatibility with silver. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004169157(A) 申请公布日期 2004.06.17
申请号 JP20020339038 申请日期 2002.11.22
申请人 MITSUBISHI PAPER MILLS LTD 发明人 KONDO TOSHIRO
分类号 C23C18/16;C23C18/42;(IPC1-7):C23C18/16 主分类号 C23C18/16
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