发明名称 |
PROCESS AND LIQUID FOR TREATING SILVER-PLATED LAYER |
摘要 |
PROBLEM TO BE SOLVED: To provide a process and a liquid for treating a silver-plated layer for improving its strength and corrosion resistance. SOLUTION: (1) In the process for treating the silver-plated layer, the silver-plated layer is treated with an organic compound having a reactivity or compatibility with silver. (2) The treatment liquid for the silver-plated layer contains the organic compound having a reactivity or compatibility with silver. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004169157(A) |
申请公布日期 |
2004.06.17 |
申请号 |
JP20020339038 |
申请日期 |
2002.11.22 |
申请人 |
MITSUBISHI PAPER MILLS LTD |
发明人 |
KONDO TOSHIRO |
分类号 |
C23C18/16;C23C18/42;(IPC1-7):C23C18/16 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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